Two-dimensional high-entropy metal oxide assembly with high thermal conductivity and preparation method thereof
US12410066B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Feb 1, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/32
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure relates to the field of new materials, and aims at providing a two-dimensional high-entropy metal oxide assembly with high thermal conductivity and a preparation method thereof. The two-dimensional high-entropy metal oxide assembly with the high thermal conductivity has a molecular formula of (Co0.3La0.6Er0.6Y0.7Mn0.4Ga0.4)O4. The two-dimensional high-entropy metal oxide assembly with the high thermal conductivity is in a short fiber shape with a length-diameter ratio of the short fiber of 5 to 7 and has a cross section of a regular triangle with the side length of the regular triangle of 100 to 300 nm. The present disclosure achieves one-dimensional high thermal conductivity of metal oxide assembly by means of orderly assembling of high-entropy oxide in the direction perpendicular to nanosheets. Meanwhile, the assembly enables uniform distribution of heterogeneous elements in the two-dimensional plane during the preparation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.