Thermal filler particle, thermally conductive composition, and assembly including the same
US12410303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2021 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Dec 22, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L33/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.