Patent · US Active

Process of manufacturing a curable precursor of a structural adhesive composition

US12410346B2 · kind B2 · utility

0Cited by
5References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 2020
Grant dateSep 9, 2025
Priority date
Expiry dateNov 12, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J179/02
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.