Bolometer unit cell pixel integrity check systems and methods
US12411047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2022 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Dec 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/77
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Techniques to test infrared detectors are disclosed. In one example, a focal plane array for an imaging system includes a plurality of infrared detectors arranged in a plurality of rows and columns where each of the infrared detectors is configured to provide an output signal in response to externally received thermal radiation associated with a scene. A plurality of offset circuits of the imaging system may be electrically coupled to the focal plane array and configured to selectively superimpose fixed-pattern noise on the output signals to provide modified output signals. A readout integrated circuit of the imaging system may be configured to provide the modified output signals for processing to test an integrity of the infrared detectors. Modified output signals that are outside an expected output range based on the thermal radiation and known offset may be determined defective. Related methods, devices, and systems are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.