Coil electronic component
US12412693B2 · kind B2 · utility
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1References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 17, 2019 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Feb 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil electronic component includes a support substrate having a thickness of 20 to 40 μm. A coil pattern is disposed on at least one of a first surface and a second surface of the support substrate opposing each other, and has an aspect ratio of 4 or higher. An encapsulant encapsulates at least portions of the support substrate and the coil pattern, and an external electrode is disposed in an external region of the encapsulant and connected to the coil pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.