Patterned design for thermal management of two-phase immersion cooling system for electronics
US12412807B2 · kind B2 · utility
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4References
10Claims
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Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | May 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.