Semiconductor module
US12412813B2 · kind B2 · utility
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0References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 19, 2020 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/53871
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.