Microelectronic assemblies including interconnects with different solder materials

US12412868B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Jeremy Ecton · Gilbert, US
• Jason M. Gamba · Pasadena, US
• Brandon C. Marin · Chandler, US
• Srinivas V. Pietambaram · Gilbert, US
• Xiaoxuan Sun · Phoenix, US
• Omkar G. Karhade · Chandler, US
• Xavier Francois Brun · Hillsboro, US
• Yonggang Li · Chandler, US
• Suddhasattwa Nad · Chandler, US
• Bohan Shan · Chandler, US
• Haobo Chen · Chandler, US
• Gang Duan · Beijing, CN

Key dates

• Filing date: Dec 21, 2021
• Grant date: Sep 9, 2025
• Expiry date: Oct 14, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.