Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package
US12413001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2021 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Dec 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.