Imaging element unit and imaging device
US12413834B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Mar 12, 2044 |
Classification
- Technology area (CPC —)General
Abstract
An imaging element unit that is built in a housing of an imaging device includes an imaging element that includes an imaging surface imaging a subject and a back surface opposite to the imaging surface, a circuit board which is mounted on the back surface and in which an opening causing a part of the back surface to be exposed therethrough is formed, and a first heat conductive member and a second heat conductive member to which driving heat of the imaging element is conducted. The first heat conductive member is connected to the second heat conductive member and has elasticity higher than elasticity of the second heat conductive member, and the second heat conductive member is connected to the back surface via the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.