Inlet heat sink for a cooling system of a supercomputer electronic board
US12414224B2 · kind B2 · utility
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3References
10Claims
0Family size
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Key dates
| Filing date | Aug 3, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Feb 25, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An inlet heat sink for a liquid cooling system of an electronic board, including a cold inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of a cooling block being configured to divide a flow of incoming heat transfer fluid by the cold inlet connector into a first flow oriented to collect the heat generated by the electronic board by being routed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.