Semiconductor device and data storage system including the same
US12414301B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2022 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Oct 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a contact plug forming a signal path electrically connecting a bitline or wordlines and an upper connection pattern to each other, a lower insulating structure includes first and second insulating portions; the contact plug penetrates through the second insulating portion and contacts the upper connection pattern; the first insulating portion includes first and second lower layers, the second lower layer having a thickness smaller than the first lower layer; the second insulating portion includes a first upper layer contacting the second lower layer and covering a portion of an upper surface of the upper connection pattern, and a second upper layer on the first upper layer, the second upper layer having a thickness greater than the first upper layer; and materials of the second lower layer and first upper layer is different from materials of the first lower layer and the second upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.