Substrate and method for manufacturing the same, and display panel
US12414374B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2021 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.