Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
US12414474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2021 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Nov 14, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/0633
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of forming a piezoelectric device may include depositing a sol-gel film over a substrate and curing the sol-gel film by impinging light onto an exposed surface of the sol-gel film to form a piezoelectric ceramic element. The method may produce a piezoelectric composite material including at least two piezoelectric ceramic pillars over the substrate. The at least two piezoelectric pillars may include at least one layer. The at least one layer having a gradient density, such that a first portion of the at least one layer proximate the substrate has a density lower than a second portion that is located a greater distance from the substrate than the first portion. The piezoelectric composite material may further include a resin separating the at least two piezoelectric ceramic pillars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.