Thermally efficient bus housing
US12415624B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Jul 16, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/503
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An orbital satellite has a bus formed of a bus module and a payload module. Both the bus module and the payload modules may include a pair of panels integrally formed at an angle of for example 90° with respect to each other. Components and electronics supporting the satellite systems may be mounted on the panels of the bus and payload modules. Heat generated by the components and electronics are conducted between panels of the bus module and/or payload module. Sufficient heat transfer between panels occurs as a result of their being integrally formed with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.