Polyimide film preparation method and application thereof
US12415892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2020 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Jan 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a polyimide film, preparation method, and application thereof. The polyimide film is a colorless transparent film with low thermal expansion. The polyimide film is obtained by taking a mixture of rigid aromatic diamine and fluorine-containing aromatic diamine, a mixture of rigid aromatic tetracarboxylic dianhydride and fluorine-containing aromatic tetracarboxylic dianhydride as raw materials, mixing the raw materials to obtain a resin solution, and then conducting imidizing and post-treating. The polyimide film not only has excellent transparency, but also has the advantages of low thermal expansion, high modulus, high glass transition temperature, and so on, and can be well applied to a flexible optoelectronic display substrate, a flexible printed circuit board, or an electronic packaging substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.