Patent · US Active

Rubber particle-doped composite chip seal and construction method thereof

US12416119B2 · kind B2 · utility

0Cited by

2References

5Claims

0Family size

Assignee

CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY · CN

Inventors

Jianguo Wei · Yongzhou, CN
Yuming Zhou · Changsha, CN
Hao Yue · Changsha, CN
Anmin Zou · Changsha, CN
Ping Li · Lausanne, CH
Haolong Ju · Changsha, CN
Qiucai Nan · Changsha, CN
Min Fu · Zhejiang, CN

Key dates

Filing date	Mar 8, 2024
Grant date	Sep 16, 2025
Priority date	—
Expiry date	Mar 8, 2044

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE01C19/4813
WIPO fieldCivil engineering
WIPO sectorOther fields

Abstract

A rubber particle-doped composite chip seal and a construction method thereof. The rubber particle-doped composite chip seal includes a coarse aggregate in a lower layer, a fine aggregate in an upper layer, and an SBS-modified emulsified asphalt binding and encapsulating the coarse aggregate and the fine aggregate into a whole, wherein the coarse aggregate is a gravel having a particle size of 4.75 mm to 7.1 mm, the fine aggregate is rubber particles having a particle size of 1.18 mm to 4.75 mm after pre-treatment, and the fine aggregate has a doping amount of 30% to 45% of a volume of all aggregates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.