Methods for interfacing a metallic microchannel and a metallic capillary
US12416452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | May 19, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.