Magnetic sensor using metal and silicon junction structure
US12416690B2 · kind B2 · utility
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Key dates
| Filing date | Jan 3, 2023 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | May 13, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/0206
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic sensor includes a silicon substrate, a cross-shaped metal pattern formed on the silicon substrate and directly contacting the silicon substrate, and an insulating layer covering the cross-shaped metal pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.