Silver-copper composite conductive paste capable of being sintered at low temperature and preparation method and use thereof
US12417860B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2025 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Jan 17, 2045 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention belongs to the technical field of packaging interface materials for electronic power devices, and particularly discloses a silver-copper composite conductive paste capable of being sintered at a low temperature, and a preparation method and use thereof. A first purpose of the invention is to provide a silver-copper composite conductive paste capable of being sintered at a low temperature, comprising, by weight, the following components: 20-80% of micro-copper particles; 10-60% of nano-silver sheets; 1-20% of nano-silver particles; and 10% of an organic carrier. The silver-copper composite conductive paste capable of being sintered at a low temperature provided by the invention adopts silver and copper of different sizes and morphologies, large-sized sliver sheets and micro-copper particles are used as skeletons, and small nano-silver particles are used for filling, such that gaps are reduced, and the performance is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.