Multi-layered structure and method for manufacturing the same
US12417949B2 · kind B2 · utility
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4References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 18, 2021 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Nov 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a multi-layered structure on a supporting entity is provided. The method includes forming a first layer and a first test mark on the supporting entity, wherein the first test mark has a first predetermined length. The first projected length of the first test mark is measured in a top view. The first warpage degree of the first test mark is calculated according to the first predetermined length and the first projected length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.