Connector
US12417953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Oct 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.