Antenna package structure
US12418103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Mar 5, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure is disposed over the first surface of the glass substrate. The plurality of semiconductor chips are mounted over the interconnect structure. The antenna array structure is formed on the second surface of the glass substrate. Furthermore, the plurality of semiconductor chips are coupled to the antenna array structure through the interconnect structure and the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.