Integral features providing improved flexible printed circuit folding and connection capability
US12418979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Aug 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.