Wiring board
US12418980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2023 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | May 14, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.