Dual flow low profile coolant distribution manifold
US12419010B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2023 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Apr 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further defines an upper internal plenum and a lower internal plenum each coupled to one of the main inlet port and the plurality of cooling plate inlet ports and the main outlet port and the plurality of cooling plate outlet ports. Optionally, the upper internal plenum and the lower internal plenum each have a variable cross-sectional area along a length of the body between the main inlet port and the main outlet port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.