High-density power supply
US12419016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2023 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Dec 2, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-density power supply includes a shell, a fan, a PFC module, a DC-DC module and a main board. The shell has a first air passage and a second air passage arranged side by side. The fan is arranged on an inner side or an outer side of the shell. The PFC module includes a PFC inductor arranged in the first air passage, and the PFC inductor faces directly to the fan. The DC-DC module is arranged in the first air passage. The DC-DC module includes at least one DC-DC conversion circuit, each of the DC-DC conversion circuits includes a first PCB and a transformer magnetic core, a transformer winding and power components arranged on the first PCB. The main board is arranged within the shell. The PFC inductor and the at least one DC-DC conversion circuit are electrically connected with the main board, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.