Electronic device and manufacturing method of the same
US12419173B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/231
Abstract
According to one embodiment, an electronic device includes a lower electrode, a second insulating layer including an opening overlapping the lower electrode, an organic layer covering the lower electrode at the opening, an upper electrode covering the organic layer, and a barrier wall on the second insulating layer. The barrier wall includes a first layer formed of a metal material and including a first side surface which is in contact with the upper electrode, a second layer disposed above the first layer and extending from the first side surface toward the opening, and a protective layer formed of a material different from a material of the organic layer and covering at least an upper surface of the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.