Device and method for coating substrates having planar or shaped surfaces by means of magnetron sputtering
US12421592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2020 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Nov 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
According to the invention, a device is provided for coating substrates having planar or shaped surfaces by means of magnetron sputtering, by means of which device surfaces having any shape, for examples lenses, aspheres or freeform surfaces which have an adjustable layer-thickness profile, can be coated such that a layer function is maintained on the substantially complete surface. A method for coating substrates having planar or shaped surfaces by means of magnetron sputtering is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.