Lithography production method

US12422400B2 · kind B2 · utility

Assignees

• CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE · FR
• ECOLE SUPERIEURE DE PHYSIQUE ET DE CHIMIE INDUSTRIELLES DE LA VILLE DE PARIS · FR
• Sorbonne Universite · FR

Inventors

• Ulrich Bockelmann · Paris, FR
• Kokoura Mensah · Paris, FR

Key dates

• Filing date: Jun 30, 2020
• Grant date: Sep 23, 2025
• Expiry date: Jan 22, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D30/6741
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for producing a device including a deposition of a first resin layer of lithography above or on a protective layer such that the protective layer is included between a conductive layer and the first resin layer; a first lithography of the first resin layer, the protective layer and the conductive layer; preserving, in at least one preserving area of the first lithography, the superposition of the first resin layer, the protective layer and the conductive layer, and depositing, at least on the at least one preserving area of the first lithography, a second resin layer of lithography without removing the first resin layer; a second lithography of the second resin and the first resin, in particular for the production of electrodes. One of the possible aims is to obtain a device without introducing an impurity into the conductive layer.