Semiconductor device package with internal magnetic shield for hall sensor
US12422459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Mar 29, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/80
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.