High temperature test device of semiconductor memory module and method for controlling module temperature thereof
US12422473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Mar 27, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a high temperature test device of a memory module. The high temperature test device includes: an airtight housing configured to seal the memory module mounted on a main board; a heater disposed above the main board inside the airtight housing; a first fan disposed on an upper portion of the airtight housing above the heater and configured to send heat from the heater to the memory module; a second fan disposed on the upper portion of the airtight housing and configured to send air inside the airtight housing to the outside of the airtight housing; and a temperature controller configured to adjust an output ratio of the first fan to the second fan during the mounting test of the memory module to manage a module temperature of the memory module to be maintained within a specified range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.