Coil electronic component
US12424375B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2024 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Feb 15, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.