Multilayer ceramic electronic component and circuit board
US12424387B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Aug 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a ceramic body having internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, and external electrodes covering the end surfaces of the ceramic body, respectively, wherein each of the external electrodes includes a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes that are led out to the corresponding end surface, a first Ni film formed on the base film, a second Ni film formed on the first Ni film, a surface layer film formed on the second Ni film, and a metal film that is formed between the first Ni film and the second Ni film and contains a metal having a Young's modulus lower than that of Ni, as a main component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.