Composite layer circuit element
US12424454B2 · kind B2 · utility
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1References
1Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 7, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Oct 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/016
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The embodiment of the disclosure provides a composite layer circuit element of an electronic device. The composite layer circuit element includes a first dielectric layer, a first circuit layer and a second dielectric layer. The first circuit layer is disposed on the first dielectric layer, and the second dielectric layer is disposed on the first circuit layer. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer in a cross section view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.