Spring finger ring laser welded on a die cast part serving as an air transmissive shielding wall
US12424506B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jul 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly for dissipating heat in a chipset comprising a shield cover having a void and a heat sink that at least partially fills the void in the shield cover. The heat sink protruding through the shield cover and pressed against the chipset with a single layer thermal pad between. The heat sink assembly including a shielding wall consisting of a plurality of elastic spring fingers, the spring fingers arranged around the periphery of the shielding wall base and in contact with the heat sink and the shield cover wherein the shielding wall encircles the chipset and is positioned between the shield cover and the heat sink. The shielding wall providing Electromagnetic Interference (EMI) and noise shielding in addition to optimizing thermal convection for the chipset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.