Semiconductor structure and manufacturing method thereof
US12424529B2 · kind B2 · utility
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5References
19Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 9, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Dec 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure includes: a substrate, a first pad being provided on the substrate; an adapter plate located on the substrate, and the bottom surface of the adapter plate covering the first pad, in which the adapter plate includes a second pad and a connecting structure, the second pad is located on any surface other than the bottom surface of the adapter plate, one end of the connecting structure is connected with the first pad, and the other end of the connecting structure is connected with the second pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.