Method for pre-assembly of compression attached memory modules
US12424777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Oct 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/737
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided for mounting a compression attached memory module (CAMM) to a printed circuit board (PCB). The apparatus includes the CAMM, a fastener and a z-axis compression connector. The CAMM includes a mounting through-hole. The fastener includes a friction snap with a first diameter. The compression connector includes a profiled mounting through-hole. The profiled mounting through-hole has a narrowest portion having a second diameter that is less than the first diameter. When the fastener is inserted through the mounting through-hole and the profiled mounting through-hole, and when the friction snap comes into contact with the narrowest portion, the friction snap is pushed through the narrowest portion, and, after pushing the friction snap through the narrowest portion, the CAMM, the compression connector, and the fastener are aligned and retained as a unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.