Method of manufacturing a window assembly with a solderless electrical connector
US12424807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Aug 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a window assembly having a solderless electrical connector includes forming a curved transparent substrate and applying a conductive ink having a thermal degradation temperature onto a surface of the curved transparent substrate. The method further includes applying an adhesive onto the surface of the curved transparent substrate adjacent to the conductive ink and optionally onto the applied conductive ink, and curing the adhesive at a temperature below the thermal degradation temperature of the conductive ink to form the solderless electrical connector with the solderless electrical connector being in electrical contact with the applied conductive ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.