Multi-mic earphone design and assembly
US12425759B2 · kind B2 · utility
0Cited by
20References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
At least one exemplary embodiment is directed to a method of earphone manufacturing with an ear canal microphone, ambient sound microphone and a speaker, where the earphone has parts that have been 3D printed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.