Additively manufactured device enclosures
US12426187B2 · kind B2 · utility
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 6, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Aug 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.