Switching board and soldering method thereof
US12426196B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | May 9, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.