Liquid cooling heat dissipation system
US12426203B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Nov 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20772
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooling heat dissipation system is provided. The system includes a first heat dissipation device, a first heat absorption device, a second heat dissipation device, a second heat absorption device, and a pump connected with the first heat dissipation device, the first heat absorption device, the second heat dissipation device or the second heat absorption device. The first heat dissipation device, the first heat absorption device, the second heat dissipation device and the second heat absorption device are connected in sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.