Circuit and system integration onto a microdevice substrate
US12426413B2 · kind B2 · utility
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28References
4Claims
0Family size
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Key dates
| Filing date | Jan 30, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8513
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.