Reactive organosilicon thixotropic agent, organosilicon encapsulation adhesive and LED element
US12426414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Apr 25, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/84
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a reactive organosilicon thixotropic agent, an organosilicon encapsulation adhesive containing the reactive organosilicon thixotropic agent, and an LED element encapsulated by using the organosilicon encapsulation adhesive. In the present disclosure, the reactive organosilicon thixotropic agent is prepared by a hydrosilylation reaction of cyclic hydrogen-containing polysiloxane or branched hydrogen-containing polysiloxane that contains phenyl with unsaturated polyether under the condition that the ratio of the total quantity of SiH bonds in the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane to the total quantity of olefinic bonds in the unsaturated polyether is greater than 1, can provides the organosilicon encapsulation adhesive with stable thixotropic property, high transparency, and excellent mechanical property and adhesion property at the same time, and thus an LED element having great encapsulation property is manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.