Earpiece and manufacturing method and customization method of the earpiece
US12427066B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2018 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2240/004
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The disclosure relates to an earpiece configured to be at least partially inserted into an ear and comprising a core comprising a material that during insertion of the earpiece into the ear is deformable above a transition temperature and non-deformable below the transition temperature. The disclosure also relates to a method of manufacturing the earpiece. The disclosure further relates to a method of customizing the earpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.