Adhesive alloys and filter medias including such adhesive alloys
US12427457B2 · kind B2 · utility
0Cited by
77References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2021 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2375/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Embodiments described herein relate generally to adhesive alloys and their use in filter media, and in particular to adhesive alloys that can be melt blown onto a filter media layer, and which are thermally activated to bond the filter media layer to another filter media layer. An adhesive alloy is provided. A thermally activated adhesive has a first melting temperature. A polymer has a second melting temperature greater than the first melting temperature. A ratio of the thermally activated adhesive in the adhesive alloy is in a range of 5 wt % to 70 wt %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.