Diamond cutting tool and method for manufacturing the same
US12427583B2 · kind B2 · utility
0Cited by
1References
5Claims
0Family size
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Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Aug 6, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a diamond cutting tool including a cutting edge portion containing single crystal diamond or binderless polycrystalline diamond and graphite, wherein when Raman spectroscopy is performed on a surface of the cutting edge portion, a ratio R1 of Ig1 to a sum of Id1 and the Ig1 is equal to or more than 0.5 and equal to or less than 1, where the Id1 represents a peak intensity of first carbon in the surface, the Ig1 represents a peak intensity of second carbon in the surface, the first carbon represents carbon that forms the single crystal diamond or the binderless polycrystalline diamond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.