Patent · US Active

Methods and devices for thickness-limited electrospray additive manufacturing

US12427717B2 · kind B2 · utility

0Cited by
1References
19Claims
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Assignee

Inventors

Key dates

Filing dateMay 15, 2020
Grant dateSep 30, 2025
Priority date
Expiry dateJul 2, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB33Y70/00
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method for simultaneous additive manufacturing and thickness-limited, electrospray deposition may include forming an electrically conductive target via additive manufacturing and exposing the electrically conductive target to an incident spray comprising a thermo-responsive polymer solution, in the presence of an electric field. The electrically conductive target may have a surface temperature, the thermo-responsive polymer solution may have a solution temperature, and the thermo-responsive polymer solution may include a non-conductive polymer. The method may further include allowing the solution temperature to deviate toward the surface temperature to a deposited temperature at which the non-conductive polymer is immobile. The method may further include allowing the non-conductive polymer to accumulate on the electrically conductive target to form a layer, having a thickness sufficient to repulse the incident spray.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.