Multicomponent layered dielectric film with surface modification
US12427754B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jan 13, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2551/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multicomponent dielectric film includes overlapping dielectric layers and outer layers that have a higher surface energy compared to the overlapping dielectric layers, the overlapping dielectric layers including at least a first polymer material, a second polymer material, and optionally a third polymer material, adjoining dielectric layers defining a generally planar interface therebetween which lies generally in an x-y plane of an x-y-z coordinate system, the interfaces between the layers delocalizing the charge build up in the layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.